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september 2009 doc id15492 rev 5 1/36 1 stbp120 overvoltage protection device with thermal shutdown features input overvoltage protection up to 28 v integrated high voltage n-channel mosfet switch low r ds(on) of 90 m integrated charge pump thermal shutdown protection softstart feature to control the inrush current enable input (en ) fault indication output (flt ) in input esd withstand voltage up to 15 kv (air discharge), up to 8 kv (contact discharge) in typical application circuit with 1f input capacitor (2 kv hbm for standalone device) certain overvoltage options compliant with the china communications standard yd/t 1591- 2006 (overvoltage protection only) small, rohs compliant 2.5 x 2 mm tdfn ? 10-lead package. applications smart phones digital cameras pda and palmtop devices mp3 players low-power handheld devices. tdfn ? 10-lead (2.5 x 2 mm) www.st.com
contents stbp120 2/36 doc id 15492 rev 5 contents 1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 input (in) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 power output (out) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 fault indication output (flt ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 enable input (en ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.5 no connect (nc) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.6 ground (gnd) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.2 normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.3 undervoltage lockout (uvlo) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.4 overvoltage lockout (ovlo) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.5 thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.1 calculating the power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.2 calculating the junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.3 pcb layout recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6 dc and ac parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 7 timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 8 typical application performance (stbp120dvdk6f) . . . . . . . . . . . . . 19 9 typical thermal characteristics (stbp120dvdk6f) . . . . . . . . . . . . . . . 24 10 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
stbp120 contents doc id 15492 rev 5 3/36 11 tape and reel specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 12 part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 13 package marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
list of tables stbp120 4/36 doc id 15492 rev 5 list of tables table 1. pin description and signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 2. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 3. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 4. operating and ac measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 5. dc and ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 6. tdfn ? 10-lead, 2.5 x 2.0 x 0.75 mm body, pitch 0.50 mm, package mechanical data dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 table 7. carrier tape dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 table 8. further tape and reel information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 table 9. reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 table 10. ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 table 11. marking description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 table 12. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
stbp120 list of figures doc id15492 rev 5 5/36 list of figures figure 1. logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 2. pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 3. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 4. typical application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 5. maximum mosfet current at t a = 85 c for various pcb thermal performance and t j = 125 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 6. startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 7. overvoltage protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 8. disable (en = high). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 9. flt behavior in disable (en = high) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 10. startup delay, t on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 11. flt indication delay (ok), t start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 12. output turn-off time, t off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 13. flt indication delay (fault), t stop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 14. disable time, t dis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 15. startup to overvoltage and startup v o(flt ) delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 16. startup inrush current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 17. output short-circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 18. output short-circuit detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 19. i cc vs. temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 figure 20. i cc(stdby) vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 figure 21. i cc(uvlo) at 2.9 v vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 figure 22. v ovlo vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 figure 23. v uvlo vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 figure 24. v ol(flt ) at 1 ma vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 figure 25. r ds(on) at 1 a vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 figure 26. tdfn ? 10-lead, 2.5 x 2.0 x 0.75 mm body, pitch 0.50 mm, package mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 figure 27. tape and reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 figure 28. reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 figure 29. tape trailer/leader. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 figure 30. pin 1 orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
description stbp120 6/36 doc id 15492 rev 5 1 description the stbp120 device provides overvoltage protection for input voltage up to +28 v. its low r ds(on) n-channel mosfet switch protects the systems connected to the out pin against failures of the dc power supplies in accordance with the china mii communications standard yd/t 1591-2006. in the event of an input overvoltage condition, the device immediately disconnects the dc power supply by turning off an internal low r ds(on) n-channel mosfet to prevent damage to protected systems. in addition, the device also monitors its own junction temperature and switches off the internal mosfet if the junction temperature exceeds the specified limit. the device can be controlled by the microcontroller and can also provide status information about fault conditions. the stbp120 is offered in a small, rohs-compliant tdfn ? 10-lead (2.5 mm x 2 mm) package. figure 1. logic diagram figure 2. pinout (1) 1. pin 1, pad1 and pad2 are no connect (nc) and may be tied to in or gnd. am00240 stbp120 in gnd en out flt am00239 in en out in out nc gnd nc nc out flt 1 2 3 4 5 10 9 8 7 6 pad1 pad2
stbp120 pin descriptions doc id 15492 rev 5 7/36 2 pin descriptions 2.1 input (in) input voltage pin. this pin is connected to the dc power supply. external low esr ceramic capacitor of minimum value 1 f must be connected between in and gnd. this capacitor is for decoupling and also protects the ic against dangerous voltage spikes and esd events. this capacitor should be located as close to the in pins as possible. all in pins (4, 5) must be hardwired to common supply. 2.2 power output (out) output voltage pin. this pin is connected to the input through a low r ds(on) n-channel mosfet switch. if no fault is detected and the stbp120 is not disabled (controlled by the en input), this switch is turned on and the output voltage follows the input voltage. the output is disconnected from the input when the input voltage is under the uvlo threshold or above the ovlo threshold, when the chip temperature is above the thermal shutdown threshold or when the chip is disabled by the en input. there is a 50 ms delay, t on , between input voltage or junction temperature returns to specified range and the power output is connected to the input (see figure 6 ). all out pins (6, 7) must be hardwired to common supply. 2.3 fault indication output (flt ) the fault indication output (active-low - open-drain) provides information on the stbp120 state to the application controller. when flt is active (i.e. driven low), this indicates the stbp120 is in the undervoltage or overvoltage condition or thermal shutdown mode is active. when the input voltage and junction temperature is in specified range, the flt output is in high impedance (hi-z) state. there is an additional 50 ms delay, t start , between the power output is connected to the input and the flt output is deactivated (i.e. in hi-z state) (see figure 6 ). since the flt output is of open-drain type, it may be pulled up by an external resistor r p to the controller supply voltage. if there is no need to use this output, it may be left disconnected. the suitable r p resistor value is in range of 10 k to 1 m . to improve safety and to prevent damage to application circuits in the event of extreme voltage or current conditions, an optional protective resistor r flt can be connected between the flt output and the controller input. the suitable r flt resistor value is in range of 22 k to 100 k . the function of the flt output is not affected by the en input state (see figure 9 ).
pin descriptions stbp120 8/36 doc id 15492 rev 5 2.4 enable input (en ) this logical input (active-low) can be used to enable or disable the device. when en input is driven high, the stbp120 enters the standby mode and the power output is disconnected from the input. when en input is driven low and all operating conditions are within specified limits, the power output is connected to the input. since the en input has no internal pull-down resistor, its logical level must be defined by the controller or by an external resistor. if there is no need to use this input, it should be connected to the gnd. to improve safety and to prevent damage to application circuits in the event of extreme voltage or current conditions, an optional protective resistor r en can be connected between the en input and the controller output. the suitable resistor value is in range of 22 k to 100 k . the en input level has no impact on the functionality of flt output (see figure 8 and figure 9 ). 2.5 no connect (nc) pins 1, 8, 9 and exposed pads pad1, pad2 are no connect. pin 1 and exposed pads pad1, pad2 may be tied to in or gnd if necessary. 2.6 ground (gnd) ground. all voltages are referenced to gnd. table 1. pin description and signal names pin name type function 1, pad1, pad2 nc ? no connect. may be tied to in or gnd. 2 gnd supply ground 3flt output fault indication output (open-drain) 4, 5 in input / supply input voltage 6, 7 out output output voltage 8, 9 nc ? no connect 10 en input enable input (no internal pull-down resistor)
stbp120 pin descriptions doc id 15492 rev 5 9/36 figure 3. block diagram figure 4. typical application circuit (1) , (2) 1. optional resistors r en , r flt prevent damage to the controller under extreme voltage or current conditions and are not required. low esr ceramic capacitor c1 is necessary to ensure proper function of the stbp120. capacitor c2 is not necessary for stbp120 but may be required by the charger ic. 2. the stbp120 mosfet switch topology allows the current to also flow in the reverse direction, from out to in, which can be useful for powering external peripherals from the system connector. the charger ic should not contain the reverse diode to prevent the battery pack voltage from appearing on the system connector. if the reverse current (supply current) is undesirable, it may be prevented by connecting a schottky diode in series with the out pin. the voltage drop between in and charger is increased by the voltage drop across the diode. gnd flt en in out counters off v ref v cc am00306 control logic supply regulator oscillator charge pump mosfet driver voltage reference input overvoltage input undervoltage thermal shutdown temperature detector mcu interface esd protection esd protection esd protection core negative protection am00314a ac adapter powered peripherals system connector supply current charging current c1 1 f in out flt en gnd en enable c2 1 f r flt r en r pu charger ic supply circuits controller battery pac k stbp120 application dc-dc or peripheral
operation stbp120 10/36 doc id 15492 rev 5 3 operation the stbp120 provides overvoltage protection for positive input voltage up to 28 v using a built-in low r ds(on) n-channel mosfet switch. 3.1 power-up at power-up, with en = low, the mosfet switch is turned on after a 50 ms delay, t on , after the input voltage exceeds the uvlo threshold to ensure the input voltage is stabilized. after an additional 50 ms delay, t start , the flt indication output is deactivated (see figure 6 ). the flt output state is valid for v in input voltage 1.2 v or higher. 3.2 normal operation the device continuously monitors the input voltage and its own internal temperature so the output voltage is kept within the specified range. internal mosfet switch is turned on and the flt output is not active. the stbp120 enters normal operation state if the input voltage returns to the interval between v uvlo and v ovlo - v hys(ovlo) and the junction temperature falls below t off - t hys(off) . internal mosfet is turned on after the 50 ms delay t on to ensure that the conditions have stabilized. then, after an additional 50 ms delay, t start , the flt output is deactivated (i.e. driven high). this behavior is equivalent to the startup shown on figure 6 . note: the stbp120 mosfet switch topology allows the current to also flow in the reverse direction, i.e. from out to in, which can be useful e.g. for powering external peripherals from the system connector (see the supply current in figure 4 ). at first, the current flows through the mosfet body diode. if the voltage that appears on the in terminal is above the uvlo threshold, the mosfet is (after the 50 ms startup delay) turned on so the voltage drop across stbp120 is significantly reduced. the charger ic should not contain the reverse diode to prevent the battery pac k voltage from appearing on the system connector. if the reverse current is undesirable, it may be prevented by connecting a properly rated low drop schottky diode in series with the out pin. the voltage drop between in and charger is increased by the voltage drop across the diode. due to the mosfet body diode, thermal shutdown protection is not functional for the supply current. 3.3 undervoltage lockout (uvlo) to ensure proper operation under any conditions, the stbp120 has an undervoltage lockout (uvlo) threshold. for rising input voltage, the output remains disconnected from input until v in voltage exceeds the v uvlo threshold (3.25 v typ). the flt output is driven low as long as v in is below the uvlo threshold (assuming t he input voltage is abov e 1.2 v). for falling input voltage, the uvlo circuit has a 50 mv hysteresis, v hys(uvlo) , to improve noise immunity under transient conditions.
stbp120 operation doc id 15492 rev 5 11/36 3.4 overvoltage lockout (ovlo) if the input voltage v in rises above the threshold level v ovlo , the mosfet switch is immediately turned off (see figure 7 ). at the same time, the fault indication output flt is activated (i.e. driven low). this device is equipped with hysteresis, v hys(ovlo) , to improve noise immunity under transient conditions. for available ovlo thresholds and hystereses, please see the ta b l e 5 . 3.5 thermal shutdown if the stbp120 internal junction temperature exceeds the t off threshold, internal mosfet switch is turned off and the fault indication output flt is driven low. to improve thermal stability, this circuit has a 20 c hysteresis, t hys(off) .
application information stbp120 12/36 doc id 15492 rev 5 4 application information 4.1 calculating the power dissipation the maximum power dissipation of the stbp120 internal power mosfet can be calculated using following formula: p d = i 2 x r ds(on)(max) , where i is current flowing through the mosfet and r ds(on)(max) is maximum value of mosfet resistance. example: r load = 5 , v in = 5 v, r ds(on)(max) = 150 m i = v in / (r ds(on)(max) + r load ) = 5 / (5 + 0.150) = 0.97 a p d = 0.97 2 x 0.15 = 0.14 w the power dissipation of reverse diode (in powering peripherals mode) can be estimated as p d = (v out - v in ) x i 0.7 x i. 4.2 calculating the junction temperature the maximum junction temperature for given power dissipation, ambient temperature and thermal resistance junction - to - ambient can be calculated as t j = t a + 1.15 x p d x r thja = t a + 1.15 x i 2 x r ds(on)(max) x r thja , where t j is junction temperature, t a is given ambient temperature, 1.15 is a derating factor and r thja is thermal resistance junction - to - ambient, depending on shape, dimension and design of pcb. two examples of pcb with appropriate thermal resistance are listed in ta b l e 3 . the junction temperature may not exceed 125 c (see table 4 ), due to t off (thermal shutdown threshold temperature). maximum allowed mosfet current for ambient temperature t a = 85 c and various r thja values are listed in figure 5 . example: for conditions listed in previous example, well designed pcb (r thja = 82 c/w) and t a = 85 c, the maximum junction temperature is 85 + 1.15 x 0.14 x 82 = 98.2 c. 4.3 pcb layout recommendations this device is intended as a protection device to the application from overvoltage. it must be ensured that the clearances between pcb tracks satisfy the high voltage design rules. input capacitor, c1, should be located as close as possible to the stbp120 device. it should be a low-esr ceramic capacitor. also the protective resistors r flt , r en (if used) should be located close to the stbp120. for good thermal performance, it is recommended to connect the stbp120 exposed thermal pads with the pcb ground plane. in most designs, this requires thermal vias between the copper pads on pcb and the ground plane.
stbp120 maximum rating doc id 15492 rev 5 13/36 5 maximum rating stressing the device above the rating listed in the ?absolute maximum ratings? table may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. refer also to the stmicroelectronics sure program and other relevant quality documents. table 2. absolute maximum ratings symbol parameter value unit t stg storage temperature (v in off) ?55 to 150 c t sld (1) 1. reflow at peak temperature of 260 c. the time above 255 c must not exceed 30 seconds. lead solder temperature for 10 seconds 260 c t j (2) 2. maximum junction temperature is internally limited by the thermal shutdown circuit (not valid for reverse current, see chapter 3.2 ). operating junction temperature range ?40 to 150 c t a operating ambient temperature range ?40 to 85 c v in input voltage (pins in) ?0.3 to 30 v v io(out) input / output voltage (pins out) ?0.3 to 12 v v io input / output voltage (other pins) ?0.3 to 7 v i in , i out(mosfet) input / output current through mosfet (pins in, out) 2000 ma i (flt ) output current (pin f lt )15ma v esd esd withstand voltage (iec 61000-4-2, pins in only) (3) 3. system-level value (see figure 4 , c1 1 f low esr ceramic capacitor). 15 (air), 8 (contact) kv human body model (hbm), model = 2 (4) 4. human body model, 100 pf discharged through a 1.5k resistor according the jesd22/a114 specification. 2000 v machine model (mm), model = b (5) 5. machine model, 200 pf discharged through all pins according the jesd22/a115 specification. 200 v
maximum rating stbp120 14/36 doc id 15492 rev 5 . figure 5. maximum mosfet current at t a = 85 c for various pcb thermal performance and t j = 125 c table 3. thermal data symbol parameter value unit r thja thermal resistance (junction to ambient) 204 (1) 82 (2) 1. the package is mounted on a 2-layers (1s) jedec board as per jesd51-7 without thermal vias underneath the exposed pads. 2. the package is mounted on a 4-layers (2s2p) jedec board as per jesd51-7 with 2 thermal vias (one underneath each exposed pad) as per jesd-51-5. thermal vias connected from exposed pad to 1'st buried copper plane of pcb. c/w r thjc thermal resistance (junction to case) 43 c/w am00428b r thja [?c/w] i (mosfet) [a] 0.70 0.90 1.10 1.30 1.50 1.70 1.90 2.10 50 100 150 200 250 300 350
stbp120 dc and ac parameters doc id 15492 rev 5 15/36 6 dc and ac parameters this section summarizes the operating measurement conditions, and the dc and ac characteristics of the device. the parameters in the dc and ac characteristics tables that follow are derived from tests performed under the measurement conditions summarized in ta b l e 4 . designers should check that the operating conditions in their circuit match the operating conditions when relying on the quoted parameters. table 4. operating and ac measurement conditions parameter value unit input voltage (v in )5v ambient operating temperature (t a ) ?40 to 85 c junction operating temperature (t j ) ?40 to 125 c output load resistance (r load )5 table 5. dc and ac characteristics symbol description test condition (1) min typ max unit v in input voltage range 1.2 28 v v uvlo input undervoltage lockout threshold 3.1 3.25 3.4 v v hys(uvlo) undervoltage lockout hysteresis 20 50 100 mv v ovlo overvoltage lockout threshold v in rises up ovlo threshold, ovlo option a 5.25 5.375 5.50 v v in rises up ovlo threshold, ovlo option b 5.30 5.50 5.70 v in rises up ovlo threshold, ovlo option c 5.71 5.90 6.10 v in rises up ovlo threshold, ovlo option d 5.70 6.02 6.40 v hys(ovlo) input overvoltage hysteresis 30 60 90 mv r ds(on) in to out resistance en = 0 v, v in = 5 v, r load connected to out 90 150 m i cc operating current en = 0 v, no load on out, v in = 5 v 170 250 a i cc(stdby) standby current en = 5 v, no load on out, v in = 5 v 96 150 a i cc(uvlo) uvlo operating current v in = 2.9 v 70 100 a v ol(flt ) flt output low level voltage 1.2 v < v in < v uvlo , i sink(flt ) = 50 a 20 400 mv v in > v ovlo , i sink(flt ) = 1 ma 400 mv i l(flt ) flt output leakage current v (flt ) = 5 v 5 na v il(en ) en low level input voltage 0.4 v v ih(en ) en high level input voltage 1.2 v i l(en ) en input leakage current v (en ) = 0 v or 5 v 5 na
dc and ac parameters stbp120 16/36 doc id 15492 rev 5 timing parameters t on startup delay time measured from v in > v uvlo to v out = 0.3 v (see figure 6 ) 30 50 70 ms t start flt indication delay (ok) time measured from v out = 0.3 v to v (flt ) = 1.2 v (see figure 6 ) 30 50 70 ms t off (2) output turn-off time time measured from v in > v ovlo to v out 0.3 v. v in increasing from 5.0 v to 8.0 v at 3.0 v/s, r load connected to out. (see figure 7 ) 1.5 5 s t stop (2) flt indication delay (fault) time measured from v in > v ovlo to v (flt ) 0.4 v. v in increasing from 5.0 v to 8.0 v at 3.0 v/s, r load connected to out. (see figure 7 ) 1s t dis (2) disable time time measured from v (en ) 1.2 v to v out < 0.3 v. r load connected to out. (see figure 8 ) 15s thermal shutdown t off thermal shutdown threshold temperature 130 145 c t hys(off) thermal shutdown hysteresis 20 c 1. test conditions described in table 4 (except where noted). 2. guaranteed by design. not tested in production. table 5. dc and ac characteristics (continued) symbol description test condition (1) min typ max unit
stbp120 timing diagrams doc id 15492 rev 5 17/36 7 timing diagrams figure 6. startup (1) 1. en input is low. figure 7. overvoltage protection (1) 1. en input is low. am00335 t start ovlo uvlo v in v out v (flt) t on 0.3 v 1.2 v am00336 t stop ovlo uvlo v in v out v (flt) t off 0.3 v 0.4 v
timing diagrams stbp120 18/36 doc id 15492 rev 5 figure 8. disable (en = high) (1) 1. flt output still indicates the v in status. figure 9. flt behavior in disable (en = high) am00337 t dis ovlo uvlo v in v out v (en) 1.2 v 0.3 v am00338 ovlo uvlo v in v flt v (en) 1.2 v 1.2 v equiv. to t on + t start
stbp120 typical application performance (stbp120dvdk6f) doc id 15492 rev 5 19/36 8 typical application performance (stbp120dvdk6f) figure 10. startup delay, t on 1. no load on the output. the ?leakage? on the v out trace is a crosstalk caused mainly by the parasitic capacitances of the mosfet switch. figure 11. flt indication delay (ok), t start
typical application performance (stbp120dvdk6f) stbp120 20/36 doc id 15492 rev 5 figure 12. output turn-off time, t off 1. 5 load on the output. figure 13. flt indication delay (fault), t stop 1. 5 load on the output.
stbp120 typical application performance (stbp120dvdk6f) doc id 15492 rev 5 21/36 figure 14. disable time, t dis 1. no change in v o(flt ) status during disable. 2. 5 load on the output. figure 15. startup to overvoltage and startup v o(flt ) delay 1. 5 load on the output.
typical application performance (stbp120dvdk6f) stbp120 22/36 doc id 15492 rev 5 figure 16. startup inrush current 1. output load 5 in parallel with c = 100 f, power supply cable inductance 1 h, power supply cable resistance 0.3 . figure 17. output short-circuit 1. see also details on figure 18 . 2. power supply cable inductance 1 h, power supply cable resistance 0.3 .
stbp120 typical application performance (stbp120dvdk6f) doc id 15492 rev 5 23/36 figure 18. output short-circuit detail 1. due to power supply cable impedance, during the output short-circuit the input voltage falls below the v uvlo threshold, resulting in turning off the power mosfet and preventing any damage to the components. 2. power supply cable inductance 1 h, power supply cable resistance 0.3 .
typical thermal characteristics (stbp120dvdk6f) stbp120 24/36 doc id 15492 rev 5 9 typical thermal characteristics (stbp120dvdk6f) figure 19. i cc vs. temperature figure 20. i cc(stdby) vs. temperature 80 90 100 110 120 130 140 150 160 170 180 ?50 0 50 100 150 temperature [?c] i cc [a] am00415 40 50 60 70 80 90 100 110 120 ?50 0 50 100 150 temperature [?c] i cc(stdby) [a] am00416
stbp120 typical thermal characteristics (stbp120dvdk6f) doc id 15492 rev 5 25/36 figure 21. i cc(uvlo) at 2.9 v vs. temperature figure 22. v ovlo vs. temperature 20.0 30.0 40.0 50.0 60.0 70.0 80.0 ?50 0 50 100 150 temperature [?c] i cc(uvlo) [a] am00417 am00420 5.8 5.9 6 6.1 6.2 6.3 ?50 0 50 100 150 temperature [?c] v ovlo [v]
typical thermal characteristics (stbp120dvdk6f) stbp120 26/36 doc id 15492 rev 5 figure 23. v uvlo vs. temperature figure 24. v ol(flt ) at 1 ma vs. temperature am00422 3.1 3.15 3.2 3.25 3.3 3.35 3.4 ?50 0 50 100 150 temperature [?c] v uvlo [v] am00424 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.1 ?50 0 50 100 150 temperature [?c] v ol(flt) [v]
stbp120 typical thermal characteristics (stbp120dvdk6f) doc id 15492 rev 5 27/36 figure 25. r ds(on) at 1 a vs. temperature 0.0 20.0 40.0 60.0 80.0 100.0 120.0 140.0 ?50 0 50 100 150 temperature [?c] r ds(on) [m ] am00427
package mechanical data stbp120 28/36 doc id 15492 rev 5 10 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com. ecopack ? is an st trademark. figure 26. tdfn ? 10-lead, 2.5 x 2.0 x 0.75 mm body, pitch 0.50 mm, package mechanical drawing e d2 -2 d2- 1 0. 02 5 10 bottom view pin#1 id 0.350 1 e2 5 e 0.10 c 2x 0.08 c 0.10 c leads co pla narity side view top view 0.10 c 2x seating a1 plane d inde x area l 0.195 0.10 c a b a b c 0.195 index ar ea k (x10) b (x 10) (x10) 10l_me a
stbp120 package mechanical data doc id 15492 rev 5 29/36 table 6. tdfn ? 10-lead, 2.5 x 2.0 x 0.75 mm body, pitch 0.50 mm, package mechanical data dimensions (1) 1. controlling dimension: millimeters. symbol (mm) (inches) note min. nom. max. min. nom. max. a 0.70 0.75 0.80 0.028 0.030 0.031 a1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 d bsc 2.50 0.098 d2-1 0.53 0.68 0.78 0.021 0.027 0.031 d2-2 0.93 1.08 1.18 0.037 0.043 0.046 e bsc 2.00 0.079 e2 0.75 0.90 1.00 0.030 0.035 0.039 e 0.50 0.020 l 0.20 0.30 0.40 0.008 0.012 0.016 k0.20 0.008 n10 10 (2) 2. n is the total number of terminals.
tape and reel specification stbp120 30/36 doc id 15492 rev 5 11 tape and reel specification figure 27. tape and reel table 7. carrier tape dimensions tape size wdepop2f 12 12.00 0.30 1.50 +0.10 / ?0.00 1.75 0.10 4.00 0.10 2.00 0.10 5.50 0.05 table 8. further tape and reel information package code w ao bo ko p1 t bulk qty. reel diameter 2 x 2.5mm tdfn 10 lead 12 2.30 0.10 2.80 0.10 1.10 0.01 4.00 0.10 0.30 0.05 3000 13 t k 0 p 1 a 0 b 0 p 2 p 0 center lines of cavity w e f d top cover tape user direction of feed am03073v2
stbp120 tape and reel specification doc id 15492 rev 5 31/36 figure 28. reel dimensions table 9. reel dimensions tape size a max. b min. c d min. n min. g t max. 12 mm 330 (13 inch) 1.5 13 0.2 20.2 60 12.4 + 2 / ? 0 18.4 a d b c n t am00443 40 mm min. acces hole at slot location tape slot in core for tape start 25 mm min width full radius g measured at hub
tape and reel specification stbp120 32/36 doc id 15492 rev 5 figure 29. tape trailer/leader figure 30. pin 1 orientation note: 1 drawings are not to scale. 2 all dimensions are in mm, unless otherwise noted. leade r trailer 10 0 mm min. start 160 mm min. 400 mm min. end am00444 to p cover tape user direction of feed sealed with cover tape no components no components components am00442a direction of feed
stbp120 part numbering doc id 15492 rev 5 33/36 12 part numbering note: other overvoltage thresholds are offered. minimum order quantities may apply. contact local sales office for availability. table 10. ordering information scheme stbp120 d v dk 6 f device type stbp120 overvoltage threshold a = 5.375 v b = 5.50 v c = 5.90 v d = 6.02 v undervoltage threshold v = 3.25 v package dk = tdfn ? 10-lead, 2.5 x 2 mm temperature range 6 = ?40 c to +85 c shipping method f = ecopack ? package, tape and reel
package marking information stbp120 34/36 doc id 15492 rev 5 13 package marking information table 11. marking description part number (1) 1. other overvoltage thresholds are offered. minimum order quantities may apply. contact local sales office for availability. overvoltage threshold (v) topside marking stbp120avxxxx 5.375 p12a stbp120bvxxxx 5.50 p12b stbp120cvxxxx 5.90 p12c stbp120dvxxxx 6.02 p12d
stbp120 revision history doc id 15492 rev 5 35/36 14 revision history table 12. document revision history date revision changes 20-mar-2009 1 initial release. 07-apr-2009 2 updated section 2 , section 3 , figure 5 , t on and t start in table 5 and shipping method in ta ble 1 0 , added section 8 and section 9 . 29-apr- 2009 3 updated the revision history table - removed the draft revisions. 01-jun-2009 4 updated features , section 4.3 , ta ble 2 , figure 5 , ta b l e 5 , figure 10 , figure 12 , figure 13 , figure 14 , figure 15 , figure 16 , figure 17 , figure 18 , removed figure 22 , figure 23 , figure 25, figure 27, figure 29 , figure 30 , added section 11: tape and reel specification . 25-sep-2009 5 document reformatted, updated overvoltage threshold option c in ta b l e 5 , ta b l e 1 0 and ta b l e 1 1 .
stbp120 36/36 doc id 15492 rev 5 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at an y time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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